Die Attach Dispensing Directory - In 1995 Datacon first introduced its future-oriented platform concept, and has since built on the modular, easily customized machine platform, resulting in today's 2200 apm and 2200 apm+ Multi-Chip Die Bonders. Utilizing expertise gained over nearly two decades, Datacon has also developed an all-new platform for dedicated flip chip assembly, the 8800 FC platform. Datacon is one of the leading and most innovative suppliers in the industry and the world's leader in flip chip technology.